Monday, June 26, 2023 

13:30 – 13:45   Welcome & Opening Session

13:45 – 14:30   Keynote on Chip Act
ChairM. Coppola (STMicroelectronic, Grenoble, F)

     “Empowering Europe's digital resilience: unleashing the potential of the EU Chips Ac​t"
           V. Renda (Associate Director for Digital Transformation Policy, DIGITALEUROPE, Brussels, B)

14:30 – 15:45 Technical Session 1: Green Electronics
Chair: A. Castillejo (STMicroelectronic, Grenoble, F)  

     “A digital product passport for sustainable and circular electronic products"     
          C. Bernier (CEA List, Grenoble, F)
     "Pathfinding Sustainable Electronics" 
          P. Nussbaum (CSEM, Neuchatel, CH)
     " Sustainable Technologies to address electronics circularity challenges" 
          P. Roquet (STMicroelectronic, Grenoble, F)

15:45 – 16:15   Break

16:15 – 17:30 Technical Session 2: RISC-V 
Chair: C. Fabre (CEA-List, Grenoble, F)

     "Design and Exploration of RISC-V Cores from High-Level Specifications" 
          O. Sentieys (Univ. Rennes, INRIA, Lannion, F)
     " A view on RISC-V research from dependable operating systems"
          H. Blasum (Sysgo, Klein-Winternheim, D)
      " VPSim Virtual Prototyping Simulator tool for High Performance Computing platforms co-design"
            M. Benazouz, A. Mouhagir, L. Zaourar (CEA List, Saclay, F)

17:30 – 18:30   Technical Session 3: The role of AI on the EDA  
Chair: M. Coppola (STMicroelectronic, Grenoble, F)

      " Automating Chip Design with AI "
            T. Bjerregaard (Synopsys, Copenhague, DK)

20:00 – 23:00   Gala Dinner
Tuesday, June 27, 2023 
08:30 – 09.00   Keynote 
ChairG. Sicard (CEA Leti, Grenoble, F)

     "Edge AI: Basics & Trends"
          M. Diaz Nava (STMicroelectronics, Grenoble, F), O. Vermesan (Sintef, NL)

09:00 – 09:45   Break with Leti Day's

09:45 – 11:45 Technical Session 4: Edge AI
Chairs: M. Diaz Nava (STMicrolectronics, Grenoble F)
           Y. Le Tiec (CEA Leti, Grenoble, F)

     " ANDANTE : AI for New Devices And Technologies at the Edge"
          M. Diaz Nava (STMicroelectronic, Grenoble, F)
     " Resistive memory-based concepts for Edge AI"
          E. Vianello (CEA Leti, Grenoble, F)
     " Merging insights from artificial and biological neural networks for neuromorphic edge intelligence"
          C. Frenkel (TU Delft, Delft, NL)
     " NeuroCorgi: preparing the path for a low-energy and low-latency AI architecture"
          I. Miro-Panades, I. Kucher, V. Lorrain, A. Valentian (CEA List, Grenoble, F)
     " Enabling Edge AI Computer Vision in mW range with scalable IPs platform"
          V. Huard (Dolphin, Grenoble, F)
     " Independent tool platform for embedded deep learning"
          V. Templier, P. Gaillard, O. Bichler, C. Moineau, I. Kucher, V. Lorrain, T. Allenet, M. Naud, M. Guibert (CEA List, Saclay, F)
     " Toolchain for Mixed-Signal Inference Accelerators with In-Memory Computing"
          M. Mallah (Fraunhoffer, D)

11:45 – 13:45   Lunch Break with Leti Day's

13:45 – 14:30   Keynote on Edge AI
Chair: O. Vermesan (Sintef, NL)

     "Pathways to Human-centred AI-driven Modular Innovation in Electronic System Design"
          H. Espinoza (Program Officer, KDT JU, Brussels, B)

14:30 – 15:45 Technical Session 5: Automotive
Chair: M. Coppola (STMicroelectronic, Grenoble, F)

     " Perspective on the use of Tiny ML boards for partitioned Electrical Electronic architectures in mobility"
          P. Perlo (I-FEVS, I)
     " Explainable Deep Learning for Automotive Applications: A Systematic Review"
          C. Pino (STMicrolectronics, I)
     SOI Technology for the automotive environment: Car interior and exterior sensing"
          L. Govoni (AED Vantage GmbH, DE)

15:45 – 17:00 Technical Session 6: Connectivity
Chair: B. Candaele (THALES, F)

     " A novel extensible NoC for the Chiplet Age"
          M. Nuessle (EXTOLL GmbH, D)
     " Transition to next generation of heterogeneous power RF Front End based on Fan-Out WLP"
          D. Floriot (UMS, F)
     " Developing 5G NTN"
          B. Candaele (THALES, F)

17:00 – 17:05   Closing Session

17:05 – 18:00   Break with Leti Day's


Conference Co-chairs: Marcello Coppola (STMicroelectronics), Gilles Sicard (CEA leti).


  •        - Martin Barnasconi, NXP, NL
  •        - Bernard Candaele, Thales Group, F
  •        - Patrick Cogez, AENEAS, F
  •        - Marcello Coppola, STMicroelectronics, F
  •        - Mario Diaz-Nava, STMicroelectronics, F
  •        - Manfred Dietrich, Dikuli, D
  •        - Thomas Fleischmann Bosch, D
  •        - Yves Gigase, ECSEL, B
  •        - Jürgen Haase, edacentrum, D
  •        - Jiri Kadlec, UTIA, CZ
    •        - Yannick Le Tiec, CEA-leti, F
  •        - Enrico Macii, Polito, I
  •        - Cosimo Musca, STMicroelectronics, I
  •        - Franck Oppenheimer, Offis D
  •        - Frederic Petrot TIMA, F
  •        - Patrick Pype, NXP, NL
  •        - Frank Schenkel MunEDA, D
  •        - Holger Schmidt, Infineon, D
  •        - Ulf Schlichtmann edacentrum, D
    •        - Peter Schneider, FHG, D
  •        - Gilles Sicard , CEA-leti, F
  •        - Anne Vandenbosch, IMEC B
  •        - Ovidiu Vermesan, Sintef, N
  •        - Eugenio Villar, U. Cantabria, E
    •        - Pascal Vivet, CEA-list, F